
TEST SOCKETS
ATE and Burn-In Test Sockets
Custom engineering, ATE, burn-in and SLT socket solutions for semiconductor characterization and production testing, supported by SI and thermal evaluation.

ATE and burn-in test sockets, analytical probe stations, probe card metrology and selected photonics test equipment — with regional sales and project support tailored to each product line.

TEST SOCKETS
Custom engineering, ATE, burn-in and SLT socket solutions for semiconductor characterization and production testing, supported by SI and thermal evaluation.

PROBE STATIONS
Manual probe stations, micropositioners, probe tips and accessories from Everbeing Intl. Corp. for DC, RF and research applications.

PROBE CARD METROLOGY
Advanced probe card analyzer platforms developed by BE Precision Technology, complemented by VX-level performance upgrades, channel expansions and modernization solutions for legacy PRVX systems.

PHOTONICS TESTING
Probing and test solutions for LED, Micro LED display, VCSEL and integrated photonics applications, including electrical and optical characterization.
HGSS connects customers with specialized manufacturers and engineering teams — from the initial inquiry and application review through technical configuration, quotation coordination, design clarification and implementation.
The portfolio covers custom ATE, burn-in and SLT test sockets; analytical probe stations and accessories; probe card analyzers and upgrades; as well as selected LED, Micro LED, VCSEL and photonics probing solutions.
Commercial handling and project execution are aligned with each product line and manufacturing partner, ensuring clear responsibilities, direct technical communication and efficient project coordination.

Hanns-Georg Ochsenkühn holds a German Diplom-Ingenieur (FH) degree in Precision Engineering, broadly comparable to a Bachelor of Engineering (Honours), and brings more than 30 years of experience in semiconductor manufacturing, wafer test, test equipment and international business development.
His professional background includes positions as Test and Laser Engineer at Siemens AG, Lead Engineer for Test Processes at Infineon Dresden, and Director of Wafer Test at Infineon Technologies and Qimonda. In these senior management roles, he led large operational teams and held responsibility for multi-million-euro production equipment and assets.
From 2011 to 2023, he served as Managing Director and owner of APS Solutions GmbH, developing and supporting semiconductor test equipment, analytical probe stations and related solutions across European markets.
In 2024, he founded HG Semiconductor Solutions. Today, HGSS provides independent sales, application support and project coordination for specialized semiconductor test and photonics solutions.