CHARACTERIZATION AND ATE
ATE Test Sockets
Custom engineering test sockets for device characterization, validation and production testing, including high-speed and application-specific contact solutions.
TEST SOCKET SOLUTIONS
Custom ATE, Burn-In and SLT Test Sockets
Engineering-Focused Solutions for Semiconductor Characterization and Production Testing
Custom socket solutions for semiconductor characterization, qualification and production testing — including high-speed, thermal, optical and application-specific designs supported by engineering review and simulation.
SOCKET PORTFOLIO
Test Socket Solutions by Application
Application-specific socket solutions for semiconductor characterization, qualification and production environments.
RELIABILITY TESTING
Burn-In Test Sockets
Socket solutions for qualification, reliability and elevated-temperature testing, designed according to package, temperature and lifetime requirements.
SYSTEM-LEVEL TEST
SLT Test Sockets
Application-specific system-level test solutions with thermal management, active cooling and support for complex board-level evaluation.
ENGINEERING SUPPORT
From Application Review to Manufacturing Release
Structured engineering support for mechanical, electrical, signal-integrity and thermal requirements.
Each project begins with a review of the package data, PCB footprint, keep-out areas, operating conditions and test objectives. Together with BONRDA engineering, HG Semiconductor Solutions coordinates contact selection, mechanical concept development, thermal design, signal-integrity evaluation, drawing review and DFM clarification through to customer approval and manufacturing release.
Where suitable, an AI-assisted design review provides an additional cross-check of package data, PCB footprints, pin assignments, dimensional constraints and revision consistency. It supplements the engineering review and does not replace manufacturer validation; final technical approval remains with BONRDA Engineering.
SIMULATION AND DESIGN VERIFICATION
Thermal and Signal-Integrity Evaluation
Simulation-supported engineering helps identify thermal and electrical performance risks before manufacturing and supports application-specific socket optimization.
Thermal Evaluation
Thermal simulation and cooling concept development help assess device temperature distribution, heat transfer and cooling performance for characterization, burn-in and system-level test applications.
Signal-Integrity Evaluation
Signal-integrity evaluation supports the review of high-speed signal paths, contact structures and socket geometry to identify potential electrical performance limitations before manufacturing.
SELECTED ENGINEERING APPLICATIONS
Application-Specific Socket Concepts
Selected examples illustrating how custom mechanical, electrical, thermal and optical requirements can be addressed through application-specific socket engineering.
Optical Device Socket
Specialized socket concept with inverted device orientation and lid-integrated signal rerouting through an interposer, providing optical access while maintaining the required board interface.
Actively Cooled SLT Socket
Application-specific system-level test socket with active cooling, thermal management and high-speed signal support, enabling an otherwise soldered high-speed device to be installed as an exchangeable socketed component under realistic operating conditions.
Support Frame for Socket Conversion
Custom support frame and socket concept developed by BONRDA to replace an originally soldered SMD device with a removable test-socket solution. This approach enables socket-based operation, easier device exchange and flexible system use without repeated soldering and rework.
PROJECT COORDINATION
Working with HG Semiconductor Solutions and BONRDA
Clear responsibilities and direct technical communication support an efficient path from the initial inquiry to manufacturing and delivery.
LOCAL PROJECT SUPPORT
HG Semiconductor Solutions (HGSS)
HG Semiconductor Solutions supports application clarification, technical coordination, quotation follow-up and communication throughout the project for customers in Europe, the United Kingdom and Israel.
ENGINEERING AND MANUFACTURING
BONRDA Engineering
BONRDA reviews the technical requirements, develops the socket concept, prepares drawings and simulations, and manages manufacturing, assembly and final technical approval.
COMMERCIAL HANDLING
Direct Business with BONRDA
Commercial quotations, purchase orders and invoicing are handled directly through Zhejiang BONRDA Technology Co., Ltd., while HG Semiconductor Solutions remains involved in project coordination and customer support.