HG Semiconductor Solutions – Home
EUROPEAN SALES AND PROJECT SUPPORT

Hauman Technologies Corp. Solutions through BE Precision Technology

European Application, Sales and Project Support by HG Semiconductor Solutions

HG Semiconductor Solutions supports the European sales and project activities of BE Precision Technology for selected Hauman Technology solutions used in LED, Mini LED, Micro LED, VCSEL and photonics device probing and characterization.

Customer communication, application clarification and project coordination are handled by Hanns-Georg Ochsenkühn as an independent sales consultant acting on behalf of BE Precision Technology. For complex applications, requirements can be reviewed jointly with the customer and Hauman Application and Sales Engineering to develop a tailored system concept.
Hauman photonics prober collage showing an automated optical and electrical test system for LED, Micro LED and VCSEL applications, with the main prober station and a close-up of multi-die probing in action with a blue measurement glow.
LED, MICRO LED, VCSEL AND PHOTONICS TEST

Optical and Electrical Test Solutions for Advanced Optoelectronic Devices

From Wafer-Level LED Testing to Micro LED and VCSEL Characterization

Hauman Technologies develops automated optical and electrical measurement systems for LED, Mini LED, Micro LED, VCSEL and related optoelectronic applications. The portfolio ranges from multi-die wafer probing and electrical/optical characterization to near-field, far-field and full-wafer non-contact micro-photoluminescence measurement.
HAUMAN OPTOELECTRONIC TEST SOLUTIONS

Three Measurement Platforms for Different Device and Test Requirements

The Hauman Technologies Corp. portfolio covers high-throughput LED and Mini LED wafer testing, integrated VCSEL beam characterization and full-wafer non-contact Micro LED inspection. Each platform can be configured according to the device structure, measurement requirements and intended use in R&D or production.
Hauman multi-die wafer probing setup for LED and Mini LED optical and electrical characterization, showing multiple probes contacting devices during active measurement.

LED and Mini LED Multi-Die Testing

HP1000 and HFP1000 platforms combine automated wafer probing with electrical and optical characterization. Multi-die architectures support parallel testing, higher throughput and integration into production-oriented automation concepts.

Explore LED & Mini LED Testing
Hauman HVP1000 VCSEL measurement platform with LIV/PIV, near-field and far-field analysis, showing beam intensity, uniformity, profile, divergence and multi-die wafer testing capabilities.

VCSEL LIV, Near-Field and Far-Field

HVP1000 and HP1000-LIV systems support integrated VCSEL characterization including LIV, near-field and far-field measurements for beam intensity, uniformity, profile, divergence and emitter analysis.

 Explore VCSEL Characterization
Hauman HPL1000 micro-photoluminescence inspection system for Micro LED full-wafer non-contact measurement, showing wavelength, intensity, die-map and optical analysis results.

HPL1000 Micro LED µPL Inspection

The HPL1000 provides automated, non-contact full-wafer micro-photoluminescence measurement with per-die data for wavelength, intensity and emission-defect analysis, supporting earlier process control, binning and traceability.

 Explore HPL1000 µPL
Hauman HP1000 LED chip prober in a semiconductor production test floor, showing a compact automated optical and electrical wafer test system with dual monitors and multi-die probing capability.
LED AND MINI LED MULTI-DIE TESTING

HP1000 / HFP1000 Optical and Electrical Measurement Platforms

Hauman HP1000 and HFP1000 platforms combine automated wafer probing with parallel electrical and optical measurement for LED and Mini LED applications. Multi-die architectures support efficient characterization while increasing test throughput and production efficiency.

  • Up to 64-die parallel measurement, depending on platform and configuration

  • Electrical characterization including VF, IR, VZ and VFD

  • Optical characterization including wavelength, peak intensity, FWHM and chromaticity
Discuss Your Application View HP1000 Technical Details

Back to Solution Overview
Hauman HVP1000 VCSEL characterization system in a laboratory environment, configured for LIV, near-field and far-field optical measurement with dual-monitor analysis.
VCSEL LIV, NEAR-FIELD AND FAR-FIELD CHARACTERIZATION

HVP1000 / HP1000-LIV/PIV Integrated VCSEL Measurement Platforms

Hauman HVP1000 and HP1000-LIV/PIV platforms provide integrated electrical and optical characterization for VCSEL devices. Depending on the configuration, the systems support LIV/PIV, Near-Field and Far-Field measurement for R&D validation as well as production-oriented test applications.

Key capabilities

  • Near-Field analysis including intensity, uniformity, beam waist,
    M² and emitter evaluation

  • Far-Field analysis including beam centroid, beam width, beam profile, divergence angle and Gaussian fit

  • Support for LIV/PIV measurement, 4"/6" wafers, multi-die testing and temperature testing up to 85 °C, depending on configuration

LIV/PIV, Near-Field and Far-Field functions can also be integrated into a combined system where maximum measurement flexibility is required, with the expected trade-off of lower overall throughput compared with dedicated high-throughput configurations.
Discuss Your Application View VCSEL Measurement Specifications

Back to Solution Overview
Hauman HPL1000 micro-photoluminescence measurement system in a cleanroom environment, shown with Micro LED wavelength, intensity and die-level inspection maps for full-wafer non-contact analysis.
MICRO LED FULL-WAFER NON-CONTACT INSPECTION

HPL1000 µPL Full-Wafer Micro LED Measurement System

Modern Micro LED wafers and carriers can contain millions of individual emitters, making representative sampling increasingly difficult. The HPL1000 is designed for automated, non-contact micro-photoluminescence measurement at die level, enabling direct optical characterization across the wafer rather than relying only on measurements from selected sites.

By generating individual measurement data for each inspected Micro LED die, the system supports earlier defect detection, wavelength and intensity binning, process monitoring and traceability. µPL results can also be correlated with later electroluminescence measurements, helping manufacturers move part of the quality decision process to an earlier, non-contact test stage.

Key capabilities

  • Full-wafer, non-contact µPL measurement with per-die identification and individual measurement records

  • Optical characterization including wavelength, intensity, FWHM/chromaticity and bright, dark or dead emission-defect inspection

  • Support for process monitoring, die-level binning, traceability and correlation with later EL measurement data

  • Suitable for Micro LED EPI wafer, COW and CoC applications. Current configurations support 4" and 6" wafers, with 8" to 12" support planned for 2027.
Discuss Your Application View HPL1000 Technical Specifications

Back to Solution Overview

Discuss Your LED, Micro LED or VCSEL Test Application

Tell us about your device, wafer or carrier format, required optical and electrical measurements, throughput targets and intended use in R&D or production. Together with BE Precision Technology and Hauman Application & Sales Engineering, we can review the requirements and develop an application-specific system concept.
Discuss Your Application

Detailed technical specifications and additional product information are available directly from Hauman Technologies.

Visit Hauman Technologies – opens in a new tab
Imprint · Privacy Policy · APS Munich Customer Information